{"id":6903,"date":"2026-05-11T17:34:09","date_gmt":"2026-05-11T09:34:09","guid":{"rendered":"https:\/\/oqitop.com\/?post_type=product&p=6903"},"modified":"2026-05-28T17:38:13","modified_gmt":"2026-05-28T09:38:13","slug":"custom-pi-copper-clad-laminate-film-fccl-single-double-sided-polyimide-composite-copper-for-flexible-circuits","status":"publish","type":"product","link":"https:\/\/oqitop.com\/de\/custom-pi-copper-clad-laminate-film-fccl-single-double-sided-polyimide-composite-copper-for-flexible-circuits\/","title":{"rendered":"Custom PI Copper Clad Laminate Film (FCCL) | Single & Double-Sided Polyimide Composite Copper for Flexible Circuits"},"content":{"rendered":"

Custom PI Copper Clad Laminate Film (FCCL)<\/span><\/h2>\n

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Einf\u00fchrung<\/strong><\/b><\/p>\n

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  1. PI Copper Clad Laminate Film (FCCL) is a flexible composite material that combines high-temperature polyimide film (PI) with rolled or electrolytic copper foil through heat lamination or adhesive\/adhesive\u2011less bonding. The polyimide layer provides excellent heat resistance, chemical stability, and dielectric properties, while the copper layer offers high electrical conductivity and fine-line etching capability. Available in single\u2011sided (1\u2011layer Cu) and double\u2011sided (2\u2011layer Cu) structures, PI FCCL is widely used in flexible printed circuits (FPC), flexible flat cables, consumer electronics, automotive electronics, and high\u2011density interconnect applications.<\/li>\n
  2. \n
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    We supply fully customizable PI composite copper laminates, including PI thickness (e.g. 12.5\u201350 \u03bcm), copper thickness (e.g. 9\u201335 \u03bcm), adhesive or adhesive\u2011less systems, and single\u2011 or double\u2011sided copper configurations. The materials feature excellent dimensional stability, solder heat resistance, and compatibility with standard FPC processes such as drilling, etching, plating, and coverlay lamination. Our PI copper clad films are produced in reference to industry standards for FCCL and can be tailored in roll width, length, and panel size to match your flexible PCB manufacturing line. OEM\/ODM and engineering support are available for both R&D and mass\u2011production projects.<\/p>\n

    Spezifikationen<\/strong><\/b><\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
    Typ<\/td>\nPI Copper Clad Laminate Film \/ PI\u2013Cu Laminate \/ Flexible Copper Clad Laminate (FCCL) \u2013 Single\u2011Sided & Double\u2011Sided<\/td>\n<\/tr>\n
    Structure<\/td>\nPolyimide (PI) film laminated with rolled or electrolytic copper foil: typically\u00a0Cu\/PI<\/strong>\u00a0(1\u2011layer copper) or\u00a0Cu\/PI\/Cu<\/strong>\u00a0(2\u2011layer copper) structures, produced by heat lamination (adhesive or adhesive\u2011less)<\/td>\n<\/tr>\n
    Base Materials<\/td>\nPolyimide film: high\u2011temperature electrical\u2011grade PI; Copper: high\u2011purity copper foil for FPC (rolled or ED), in accordance with common FCCL \/ PCB copper foil standards<\/td>\n<\/tr>\n
    PI Thickness<\/td>\nCustomizable PI thickness, typically\u00a012.5 \u03bcm, 25 \u03bcm, 50 \u03bcm<\/strong>\u00a0(other thicknesses on request)<\/td>\n<\/tr>\n
    Copper Thickness<\/td>\nCustomizable copper thickness, commonly\u00a09 \u03bcm, 12 \u03bcm, 18 \u03bcm, 35 \u03bcm<\/strong>\u00a0(\u00bd oz to 1 oz and above)<\/td>\n<\/tr>\n
    Total Laminate Thickness<\/td>\nDetermined by PI + copper layer(s); typical total thickness range approx.\u00a020\u2013100 \u03bcm<\/strong>\u00a0depending on structure<\/td>\n<\/tr>\n
    Electrical & Thermal Props.<\/td>\nCopper layers provide high electrical conductivity and good in\u2011plane thermal conductivity; PI film offers excellent dielectric strength and insulation<\/td>\n<\/tr>\n
    Mechanical Properties<\/td>\nHigh flexibility, bend resistance, and dimensional stability; suitable for dynamic bending in flexible printed circuit (FPC) applications<\/td>\n<\/tr>\n
    Heat Resistance<\/td>\nExcellent high\u2011temperature performance; PI base typically withstands soldering and reflow profiles, with continuous operating temperatures up to\u00a0200\u2013260\u202f\u00b0C<\/strong>\u00a0(grade\u2011dependent)<\/td>\n<\/tr>\n
    Formular<\/td>\nSupplied in rolls (coils) or cut sheets\/panels; suitable for roll\u2011to\u2011roll FPC processing or sheet\u2011based PCB fabrication<\/td>\n<\/tr>\n
    Width & Length<\/td>\nRoll width typically from\u00a0250 mm to 1,250 mm<\/strong>\u00a0(depending on product line); roll length according to thickness and order specification<\/td>\n<\/tr>\n
    Surface Finish (Cu Side)<\/td>\nStandard drum\u2011side \/ matte\u2011side finishes for copper; options for treated\/roughened surfaces to enhance photoresist and etching performance<\/td>\n<\/tr>\n
    Adhesive System<\/td>\nAvailable as\u00a0adhesive\u2011type FCCL<\/strong>\u00a0(with adhesive layer between Cu and PI) and\u00a0adhesive\u2011less FCCL<\/strong>\u00a0(direct bonding), selected according to heat resistance, flexibility, and reliability requirements<\/td>\n<\/tr>\n
    Dimensional Tolerances<\/td>\nTight control of copper and PI thickness, width, warpage, and shrinkage to ensure fine\u2011line etching and stable registration in FPC and flexible PCB manufacturing<\/td>\n<\/tr>\n
    Standards & Reference<\/td>\nManufactured with reference to industry standards for flexible copper clad laminates (FCCL) and PI films (e.g., IPC\/JPCA, IEC, GB\/T for FPC base materials)<\/td>\n<\/tr>\n
    Application Range<\/td>\nFlexible printed circuits (FPC), flexible flat cables (FFC), mobile phones, tablets, wearables, automotive electronics, camera modules, LED modules, and other high\u2011density interconnect and flexible electronics applications<\/td>\n<\/tr>\n
    Processing Capability<\/td>\nCompatible with drilling, punching, laser cutting, dry\u2011film lamination, etching, plating, coverlay lamination, stiffener bonding, and reflow soldering processes used in FPC manufacturing<\/td>\n<\/tr>\n
    Customization<\/td>\nTailored PI and copper thickness combinations, single\u2011 or double\u2011sided copper, adhesive or adhesive\u2011less systems, roll width\/length, and sheet formats according to customer drawings and process requirements<\/td>\n<\/tr>\n
    Packaging<\/td>\nSupplied in clean, moisture\u2011protected rolls or sheets with core protection; vacuum or moisture\u2011barrier packing and carton\/wooden\u2011case outer packaging for safe storage and long\u2011distance transport<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/li>\n<\/ol>\n

    Referenzma\u00dfe<\/strong><\/b><\/p>\n\n\n\n\n\n
    0.1mm*50mm*5000mm<\/td>\n0.2mm*100mm*10000mm<\/td>\n0.1mm*200mm*20000mm<\/td>\n<\/tr>\n
    0.2mm*300mm*300000mm<\/td>\n0.3mm*500mm*50000mm<\/td>\n0.1mm*500mm*100000mm<\/td>\n<\/tr>\n
    0.2mm*500mm*200000mm<\/td>\n0.1mm to 50mm*1000mm*1000000mm<\/td>\nDie Gr\u00f6\u00dfe kann individuell angepasst werden.<\/span><\/strong><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

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