{"id":7111,"date":"2026-05-10T23:32:12","date_gmt":"2026-05-10T15:32:12","guid":{"rendered":"https:\/\/oqitop.com\/?post_type=product&p=7111"},"modified":"2026-06-03T23:37:27","modified_gmt":"2026-06-03T15:37:27","slug":"high-conductivity-copper-honeycomb-core-panels-for-thermal-management-and-emi-shielding","status":"publish","type":"product","link":"https:\/\/oqitop.com\/fr\/high-conductivity-copper-honeycomb-core-panels-for-thermal-management-and-emi-shielding\/","title":{"rendered":"High-Conductivity Copper Honeycomb Core & Panels for Thermal Management and EMI Shielding"},"content":{"rendered":"

Custom Copper Honeycomb Core<\/span><\/strong><\/h3>\n

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Introduction<\/strong><\/b><\/p>\n

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  1. Our copper honeycomb is engineered for applications that demand both high thermal and electrical conductivity in a lightweight structure. Manufactured from high-purity copper foil and formed into a precision hexagonal cell geometry, it provides an excellent strength-to-weight ratio along with superior compressive and shear performance. Compared with solid copper plates or conventional foam, copper honeycomb offers efficient load-bearing capability while significantly reducing overall weight, making it ideal for advanced electronics, aerospace, and precision engineering projects.<\/li>\n
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    Thanks to copper\u2019s intrinsic properties, this honeycomb structure delivers outstanding heat dissipation, current-carrying capability, and EMI\/RFI shielding performance. It is widely used in heat exchangers, cooling modules, radar and communication equipment, and high-frequency test environments. We offer customizable cell sizes, foil thicknesses, core thickness, and finished sandwich panels with various facing materials to match your exact design and performance requirements. Copper honeycomb can be supplied as raw core blocks, CNC-cut parts, or fully bonded panels ready for integration into your system.<\/p>\n

    Sp\u00e9cifications<\/strong><\/b><\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
    Type<\/td>\nCopper honeycomb core \/ honeycomb sandwich panels \/ blocks; supplied as core-only or bonded with skins (copper, aluminum, stainless steel, carbon steel, FRP, stone, ceramic, etc.) for structural, thermal management, EMI\/RFI shielding, and energy\u2011absorption applications.<\/td>\n<\/tr>\n
    Structure<\/td>\nRegular hexagonal (or special geometry) cells made from thin copper foil, expanded or corrugated and then bonded\/brazed to form a lightweight, high\u2011stiffness honeycomb structure with excellent electrical and thermal conductivity, good strength, and durability.<\/td>\n<\/tr>\n
    Copper Grade<\/td>\nTypically high\u2011purity electrolytic tough pitch (ETP) copper or oxygen\u2011free copper (OF\/OFHC) for good electrical and thermal conductivity; other copper alloys (e.g., brass, bronze) can be supplied for specific mechanical, corrosion, or cost requirements upon request.<\/td>\n<\/tr>\n
    Cell Size<\/td>\nTypical cell size from about 3 mm to 19 mm (e.g., 1\/8″, 3\/16″, 1\/4″, 3\/8″, 1\/2″); smaller cells provide higher compressive and shear strength and more uniform surfaces, while larger cells reduce weight and improve airflow or fluid passage for cooling, filtration, and flow\u2011control uses.<\/td>\n<\/tr>\n
    Cell Shape<\/td>\nStandard hexagonal cells as default; special geometries (over\u2011expanded, rectangular, or custom patterns) and perforated cells available to meet airflow, pressure\u2011drop, acoustic, catalytic support, or bonding requirements.<\/td>\n<\/tr>\n
    Foil Thickness<\/td>\nCopper foil thickness typically from about 0.03 mm to 0.2 mm (approx. 0.0012″\u20130.008″), selected according to required compressive strength, shear strength, impact resistance, and weight; thicker foil used for heavy\u2011duty, high\u2011load, or high\u2011temperature service.<\/td>\n<\/tr>\n
    Overall Thickness Range<\/td>\nCore thickness typically from about 3 mm to 300 mm or more; finished sandwich panel thickness depends on core height and facing skins, commonly in the range of 5\u2013100 mm for electronics, architectural, transportation, and industrial applications.<\/td>\n<\/tr>\n
    Panel Size (L \u00d7 W)<\/td>\nCore blocks and panels available from small cut pieces to large\u2011format panels (e.g., up to approx. 1220 \u00d7 2440 mm or larger, depending on production line, copper grade, and transport conditions); special sizes, shapes, and contoured parts available on request.<\/td>\n<\/tr>\n
    Density Range<\/td>\nDensity adjustable via cell size, foil thickness, and copper grade; typical relative density around 3%\u201315% of solid copper, providing significantly reduced weight while maintaining high stiffness and excellent thermal\/electrical performance compared with solid sheet or plate.<\/td>\n<\/tr>\n
    Mechanical Properties<\/td>\nHigh stiffness\u2011to\u2011weight and strength\u2011to\u2011weight ratio; good compressive and in\u2011plane\/out\u2011of\u2011plane shear properties; suitable as a load\u2011bearing or stiffening core in structures where both mechanical performance and high thermal\/electrical conductivity are required.<\/td>\n<\/tr>\n
    Thermal & Acoustic<\/td>\nExcellent thermal conductivity through copper combined with an open\u2011cell structure that supports airflow and efficient heat exchange; widely used in heat sinks, heat exchangers, thermal management modules, and energy absorbers; can be combined with perforated skins or fillers for acoustic control.<\/td>\n<\/tr>\n
    Electrical & EMI<\/td>\nHigh electrical conductivity enables effective EMI\/RFI shielding and current\u2011carrying functions; often used in waveguides, RF attenuators, shielding panels, and grounding structures for electronic, telecommunication, and radar systems.<\/td>\n<\/tr>\n
    Surface Finish (Core)<\/td>\nCore typically supplied in bare (mill finish) copper; surfaces can be degreased, chemically cleaned, or lightly coated (e.g., anti\u2011tarnish treatments) as required; edges can be cut, machined, or potted to suit bonding, environmental, or cleanliness requirements.<\/td>\n<\/tr>\n
    Surface Finish (Panels)<\/td>\nWith skins: available in mill finish, brushed, polished, or patterned copper surfaces; optional surface treatments such as clear coatings, anti\u2011oxidation layers, patina finishes, painting, or powder coating can be provided according to aesthetic and corrosion\u2011protection needs.<\/td>\n<\/tr>\n
    Bonding & Adhesives<\/td>\nCores bonded to skins using structural adhesives (epoxy, polyurethane, high\u2011temperature film adhesives) or by brazing\/soldering depending on design, temperature, and electrical\/thermal requirements; bonding systems selected to match copper and the service environment.<\/td>\n<\/tr>\n
    Fire & Temperature<\/td>\nCopper honeycomb core is non\u2011combustible and suitable for many high\u2011temperature and fire\u2011resistant applications; overall performance depends on skin material and adhesive or brazed joints; used in heat shields, fire\u2011resistant panels, and thermal protection systems within rated limits.<\/td>\n<\/tr>\n
    Corrosion Resistance<\/td>\nCopper offers good corrosion resistance in many environments; performance can be further improved by appropriate alloy selection, surface treatments, or coatings; for aggressive or outdoor conditions, protective coatings or compatible skin materials are recommended.<\/td>\n<\/tr>\n
    Processing & Forming<\/td>\nCore can be cut, CNC\u2011machined, water\u2011jet cut, laser cut, and formed into contoured shapes; panels can be routed, folded, bent, drilled, soldered\/brazed, and mechanically fastened according to design; suitable for integration into electronic assemblies and structural frames.<\/td>\n<\/tr>\n
    Dimensional Tolerances<\/td>\nControlled cell size, core thickness, and flatness; specific tolerances for core and finished panels can be provided according to project specifications or applicable standards (e.g., thickness, bow, twist, and dimensional accuracy for structural or thermal\/EMI applications).<\/td>\n<\/tr>\n
    Standards & Reference<\/td>\nManufactured with reference to relevant copper material and honeycomb\/sandwich standards (e.g., ASTM, EN, ISO) covering copper grades, mechanical properties, conductivity, and quality control of honeycomb core and panels; additional industry\u2011specific specs can be followed on request.<\/td>\n<\/tr>\n
    Application Range<\/td>\nThermal management systems (heat sinks, heat exchangers), EMI\/RFI shielding panels, RF attenuators, aerospace and electronics cooling modules, high\u2011performance filters, flow straighteners, energy absorbers, architectural features, and other components requiring high conductivity and low weight.<\/td>\n<\/tr>\n
    Customization<\/td>\nCustom cell size, density, copper grade, core thickness, panel size, skin material (copper, aluminum, stainless, steel, FRP, stone, ceramic, etc.), surface finish, perforation, and machining per drawings, CAD models, or technical specifications.<\/td>\n<\/tr>\n
    Form of Supply<\/td>\nSupplied as raw copper honeycomb core blocks, cut\u2011to\u2011size cores, shaped or contoured cores, or fully assembled honeycomb sandwich panels ready for installation or further fabrication; optional edge\u2011closing, framing, inserts, and mounting features available.<\/td>\n<\/tr>\n
    Packaging<\/td>\nCores and panels packed with edge protection and moisture\u2011resistant wrapping; suitable separators, wooden pallets, or crates used to maintain flatness and prevent mechanical damage, oxidation, or contamination during transport and storage; special packaging available for clean or high\u2011value parts.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/li>\n<\/ol>\n

    Reference dimensions<\/strong><\/b><\/p>\n\n\n\n\n\n
    0.1mm*50mm*50mm<\/td>\n0.2mm*100mm*100mm<\/td>\n0.1mm*200mm*200mm<\/td>\n<\/tr>\n
    0.2mm*300mm*3000mm<\/td>\n0.3mm*500mm*500mm<\/td>\n0.1mm*500mm*1000mm<\/td>\n<\/tr>\n
    0.2mm*500mm*2000mm<\/td>\n0.1mm to 50mm*1000mm*1000mm<\/td>\n\n

    La taille peut \u00eatre personnalis\u00e9e.<\/span><\/strong><\/h4>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

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