Custom PI Copper Clad Laminate Film (FCCL) | Single & Double-Sided Polyimide Composite Copper for Flexible Circuits

Custom PI Copper Clad Laminate Film (FCCL)

はじめに

1. PI Copper Clad Laminate Film (FCCL) is a flexible composite material that combines high-temperature polyimide film (PI) with rolled or electrolytic copper foil through heat lamination or adhesive/adhesive‑less bonding. The polyimide layer provides excellent heat resistance, chemical stability, and dielectric properties, while the copper layer offers high electrical conductivity and fine-line etching capability. Available in single‑sided (1‑layer Cu) and double‑sided (2‑layer Cu) structures, PI FCCL is widely used in flexible printed circuits (FPC), flexible flat cables, consumer electronics, automotive electronics, and high‑density interconnect applications.

2. We supply fully customizable PI composite copper laminates, including PI thickness (e.g. 12.5–50 μm), copper thickness (e.g. 9–35 μm), adhesive or adhesive‑less systems, and single‑ or double‑sided copper configurations. The materials feature excellent dimensional stability, solder heat resistance, and compatibility with standard FPC processes such as drilling, etching, plating, and coverlay lamination. Our PI copper clad films are produced in reference to industry standards for FCCL and can be tailored in roll width, length, and panel size to match your flexible PCB manufacturing line. OEM/ODM and engineering support are available for both R&D and mass‑production projects.

   仕様

   タイプ	PI Copper Clad Laminate Film / PI–Cu Laminate / Flexible Copper Clad Laminate (FCCL) – Single‑Sided & Double‑Sided
   Structure	Polyimide (PI) film laminated with rolled or electrolytic copper foil: typically Cu/PI (1‑layer copper) or Cu/PI/Cu (2‑layer copper) structures, produced by heat lamination (adhesive or adhesive‑less)
   Base Materials	Polyimide film: high‑temperature electrical‑grade PI; Copper: high‑purity copper foil for FPC (rolled or ED), in accordance with common FCCL / PCB copper foil standards
   PI Thickness	Customizable PI thickness, typically 12.5 μm, 25 μm, 50 μm (other thicknesses on request)
   Copper Thickness	Customizable copper thickness, commonly 9 μm, 12 μm, 18 μm, 35 μm (½ oz to 1 oz and above)
   Total Laminate Thickness	Determined by PI + copper layer(s); typical total thickness range approx. 20–100 μm depending on structure
   Electrical & Thermal Props.	Copper layers provide high electrical conductivity and good in‑plane thermal conductivity; PI film offers excellent dielectric strength and insulation
   Mechanical Properties	High flexibility, bend resistance, and dimensional stability; suitable for dynamic bending in flexible printed circuit (FPC) applications
   Heat Resistance	Excellent high‑temperature performance; PI base typically withstands soldering and reflow profiles, with continuous operating temperatures up to 200–260 °C (grade‑dependent)
   フォーム	Supplied in rolls (coils) or cut sheets/panels; suitable for roll‑to‑roll FPC processing or sheet‑based PCB fabrication
   Width & Length	Roll width typically from 250 mm to 1,250 mm (depending on product line); roll length according to thickness and order specification
   Surface Finish (Cu Side)	Standard drum‑side / matte‑side finishes for copper; options for treated/roughened surfaces to enhance photoresist and etching performance
   Adhesive System	Available as adhesive‑type FCCL (with adhesive layer between Cu and PI) and adhesive‑less FCCL (direct bonding), selected according to heat resistance, flexibility, and reliability requirements
   Dimensional Tolerances	Tight control of copper and PI thickness, width, warpage, and shrinkage to ensure fine‑line etching and stable registration in FPC and flexible PCB manufacturing
   Standards & Reference	Manufactured with reference to industry standards for flexible copper clad laminates (FCCL) and PI films (e.g., IPC/JPCA, IEC, GB/T for FPC base materials)
   Application Range	Flexible printed circuits (FPC), flexible flat cables (FFC), mobile phones, tablets, wearables, automotive electronics, camera modules, LED modules, and other high‑density interconnect and flexible electronics applications
   Processing Capability	Compatible with drilling, punching, laser cutting, dry‑film lamination, etching, plating, coverlay lamination, stiffener bonding, and reflow soldering processes used in FPC manufacturing
   Customization	Tailored PI and copper thickness combinations, single‑ or double‑sided copper, adhesive or adhesive‑less systems, roll width/length, and sheet formats according to customer drawings and process requirements
   Packaging	Supplied in clean, moisture‑protected rolls or sheets with core protection; vacuum or moisture‑barrier packing and carton/wooden‑case outer packaging for safe storage and long‑distance transport

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