High-Conductivity Copper Honeycomb Core for EMI Shielding

CATEGORIES

CONTACT US

High-Conductivity Copper Honeycomb Core & Panels: Precision EMI Shielding and Thermal Management Solutions

Product Description

Custom Copper Honeycomb Core

 

 

Introduction

  1. Our copper honeycomb core is manufactured from high-purity copper foil, offering a unique combination of a lightweight hexagonal structure and exceptional electrical and thermal conductivity. Unlike aluminum or stainless steel alternatives, copper honeycomb provides significantly higher heat transfer rates and superior current-carrying capabilities. The precision-engineered cell geometry ensures remarkable structural rigidity and an excellent strength-to-weight ratio, making it an indispensable material for high-performance cooling systems, aerospace components, and advanced energy absorption applications.
  2. Specifically designed for demanding environments, our copper honeycomb products are the industry standard for high-level EMI/RFI shielding and ventilation. The open-cell architecture allows for optimal airflow and minimal pressure drop while effectively attenuating electromagnetic interference in waveguides and electronic enclosures. We offer extensive customization options, including various cell sizes, foil thicknesses, and fully bonded sandwich panels. Whether you require raw core blocks for industrial heat exchangers or finished panels for laboratory shielding, our copper honeycomb is engineered to meet your exact technical specifications.

    Specifications

    Type Copper honeycomb core / honeycomb sandwich panels / blocks; supplied as core-only or bonded with skins (copper, aluminum, stainless steel, carbon steel, FRP, stone, ceramic, etc.) for structural, thermal management, EMI/RFI shielding, and energy‑absorption applications.
    Structure Regular hexagonal (or special geometry) cells made from thin copper foil, expanded or corrugated and then bonded/brazed to form a lightweight, high‑stiffness honeycomb structure with excellent electrical and thermal conductivity, good strength, and durability.
    Copper Grade Typically high‑purity electrolytic tough pitch (ETP) copper or oxygen‑free copper (OF/OFHC) for good electrical and thermal conductivity; other copper alloys (e.g., brass, bronze) can be supplied for specific mechanical, corrosion, or cost requirements upon request.
    Cell Size Typical cell size from about 3 mm to 19 mm (e.g., 1/8″, 3/16″, 1/4″, 3/8″, 1/2″); smaller cells provide higher compressive and shear strength and more uniform surfaces, while larger cells reduce weight and improve airflow or fluid passage for cooling, filtration, and flow‑control uses.
    Cell Shape Standard hexagonal cells as default; special geometries (over‑expanded, rectangular, or custom patterns) and perforated cells available to meet airflow, pressure‑drop, acoustic, catalytic support, or bonding requirements.
    Foil Thickness Copper foil thickness typically from about 0.03 mm to 0.2 mm (approx. 0.0012″–0.008″), selected according to required compressive strength, shear strength, impact resistance, and weight; thicker foil used for heavy‑duty, high‑load, or high‑temperature service.
    Overall Thickness Range Core thickness typically from about 3 mm to 300 mm or more; finished sandwich panel thickness depends on core height and facing skins, commonly in the range of 5–100 mm for electronics, architectural, transportation, and industrial applications.
    Panel Size (L × W) Core blocks and panels available from small cut pieces to large‑format panels (e.g., up to approx. 1220 × 2440 mm or larger, depending on production line, copper grade, and transport conditions); special sizes, shapes, and contoured parts available on request.
    Density Range Density adjustable via cell size, foil thickness, and copper grade; typical relative density around 3%–15% of solid copper, providing significantly reduced weight while maintaining high stiffness and excellent thermal/electrical performance compared with solid sheet or plate.
    Mechanical Properties High stiffness‑to‑weight and strength‑to‑weight ratio; good compressive and in‑plane/out‑of‑plane shear properties; suitable as a load‑bearing or stiffening core in structures where both mechanical performance and high thermal/electrical conductivity are required.
    Thermal & Acoustic Excellent thermal conductivity through copper combined with an open‑cell structure that supports airflow and efficient heat exchange; widely used in heat sinks, heat exchangers, thermal management modules, and energy absorbers; can be combined with perforated skins or fillers for acoustic control.
    Electrical & EMI High electrical conductivity enables effective EMI/RFI shielding and current‑carrying functions; often used in waveguides, RF attenuators, shielding panels, and grounding structures for electronic, telecommunication, and radar systems.
    Surface Finish (Core) Core typically supplied in bare (mill finish) copper; surfaces can be degreased, chemically cleaned, or lightly coated (e.g., anti‑tarnish treatments) as required; edges can be cut, machined, or potted to suit bonding, environmental, or cleanliness requirements.
    Surface Finish (Panels) With skins: available in mill finish, brushed, polished, or patterned copper surfaces; optional surface treatments such as clear coatings, anti‑oxidation layers, patina finishes, painting, or powder coating can be provided according to aesthetic and corrosion‑protection needs.
    Bonding & Adhesives Cores bonded to skins using structural adhesives (epoxy, polyurethane, high‑temperature film adhesives) or by brazing/soldering depending on design, temperature, and electrical/thermal requirements; bonding systems selected to match copper and the service environment.
    Fire & Temperature Copper honeycomb core is non‑combustible and suitable for many high‑temperature and fire‑resistant applications; overall performance depends on skin material and adhesive or brazed joints; used in heat shields, fire‑resistant panels, and thermal protection systems within rated limits.
    Corrosion Resistance Copper offers good corrosion resistance in many environments; performance can be further improved by appropriate alloy selection, surface treatments, or coatings; for aggressive or outdoor conditions, protective coatings or compatible skin materials are recommended.
    Processing & Forming Core can be cut, CNC‑machined, water‑jet cut, laser cut, and formed into contoured shapes; panels can be routed, folded, bent, drilled, soldered/brazed, and mechanically fastened according to design; suitable for integration into electronic assemblies and structural frames.
    Dimensional Tolerances Controlled cell size, core thickness, and flatness; specific tolerances for core and finished panels can be provided according to project specifications or applicable standards (e.g., thickness, bow, twist, and dimensional accuracy for structural or thermal/EMI applications).
    Standards & Reference Manufactured with reference to relevant copper material and honeycomb/sandwich standards (e.g., ASTM, EN, ISO) covering copper grades, mechanical properties, conductivity, and quality control of honeycomb core and panels; additional industry‑specific specs can be followed on request.
    Application Range Thermal management systems (heat sinks, heat exchangers), EMI/RFI shielding panels, RF attenuators, aerospace and electronics cooling modules, high‑performance filters, flow straighteners, energy absorbers, architectural features, and other components requiring high conductivity and low weight.
    Customization Custom cell size, density, copper grade, core thickness, panel size, skin material (copper, aluminum, stainless, steel, FRP, stone, ceramic, etc.), surface finish, perforation, and machining per drawings, CAD models, or technical specifications.
    Form of Supply Supplied as raw copper honeycomb core blocks, cut‑to‑size cores, shaped or contoured cores, or fully assembled honeycomb sandwich panels ready for installation or further fabrication; optional edge‑closing, framing, inserts, and mounting features available.
    Packaging Cores and panels packed with edge protection and moisture‑resistant wrapping; suitable separators, wooden pallets, or crates used to maintain flatness and prevent mechanical damage, oxidation, or contamination during transport and storage; special packaging available for clean or high‑value parts.

Reference dimensions

0.1mm*50mm*50mm 0.2mm*100mm*100mm 0.1mm*200mm*200mm
0.2mm*300mm*3000mm 0.3mm*500mm*500mm 0.1mm*500mm*1000mm
0.2mm*500mm*2000mm 0.1mm to 50mm*1000mm*1000mm

The size can be customized

 

Leave Your Message

Products Recommended

Email: James@oqitop.com WhatsApp: +8615606950920 WeChat:18659227661